With the tape-out of our UWB digital chip, we can now tackle the wireless applications and product opportunities demanding high performance UWB solutions. Modules will be assembled shortly after we receive first silicon. Evaluation and product development kits containing both UWB chips are expected to be available for shipment by the end of second quarter 2006.  -   Tom Hamilton     Quotes
With the tape-out of our UWB digital chip, we can now tackle the wireless applications and product opportunities demanding high performance UWB solutions. Modules will be assembled shortly after we receive first silicon. Evaluation and product development kits containing both UWB chips are expected to be available for shipment by the end of second quarter 2006. Tom Hamilton